Authors:Laith Hassan Auda,Ahmed R. Al-Hamaoy,
Keywords:Laser Drilling,Soda Lime Glass,Brittle Materials Drilling,Under Water Laser Process,CO2 Laser,
AbstractLaser drilling is one of the earliest applications of lasers in materials processing. Less than 0.25mm in diameter is difficult to drill mechanically. Laser drilling offers good choices for small hole drilling, especially for hard and brittle materials, such as ceramics, but cracks appearance is one of the most difficulties that appears in this drilling. Therefore, this paper aims to study the effect of exposure time on the drilling of soda lime glass (SLG) using under water laser drilling technique. A 1.15 mm thickness SLG sheets were immersed 1mm below the water surface, then irradiated with CW CO2 laser. The laser parameters used were (24, 25 and 26) W power, (5, 7.5 and 10) sec exposure time and (1, 2and 3) pulses. The drilled points were investigated under optical transmission microscope. Then the upper diameter, lower diameter, crack length and taper angle for these drilled holes were measured by analyzing the OM images using ImageJ software. Clearly appeared that hole diameter and the crack lengths could be controlled by the laser power and exposure time. When power or time were increased, the hole diameter increased. While the length of cracks is increased with increasing time and power. The good results found at laser power 24 W, five sec. and one pulse for hole diameter, while the minimum crack length was found at three pulses, five sec. and 24 W power.
I. Asibu, E. (2009). Principles of Laser Materials Processing (Vol. 4). New Jersey, Canada: John Wiley & Sons.
II. B.Nafissa, & A.walid. (2015, september 28). Optimization of Parameters CO2 Laser for Drilling Different Types of Glass. new journal of glass and ceramics, 5, 87-83.
III. Corcorn A, S. L. (2002). “The Laser drilling of multi-layer aerospace material systems. Journal of materials systems, 123(1), 100-106.
IV. E. Kacar, M. M. (2009, April 25). Characterization of the drilling alumina ceramic using Nd:YAG pulsed laser. Journal of Materials Processing Technology, 209, 2008-2014.
V. Fenga, W., Guob, J., Yana, W., Wana, Y. C., & Zhenga, H. (2019, February 16). Deep channel fabrication on copper by multi-scan underwater laser machining. Optics and Laser Technology, 111, 653-663.
VI. Maini.K.A. (2013). Lasers and Optoelectronics;Fundamentals,Devices and Applications. United Kingdom: John Wiley &Sons.
VII. Ogura, H., & Yoshida, Y. (2003, May). Hole Drilling of Glass Substrates with a CO2 Laser. Jpn. J. Appl. Phys., 42(Part 1, 5A), 2881–2886.
VIII. Richard . H, J. .. (1998). Laser Ablation and Desorption (Vol. 30). San Diego, USA: Academic Press.
IX. Sun, X., Zhou, J., Duan, J.-A., D, H., & Cui., D. (2018, November 27). Experimental research on ultrasound-assisted under water femtosecond laser drilling. Cambridge University Press, 36, 487-493.
X. Sushant. D, N. S. (2006). A review on laser drilling and its techniques. International Conference on Advances in Mechanical Engineering (AME 2006). Fatehgarh Sahib , Pungab , India.
XI. Tsai, C., & Li, C. (2009, june 22). Investigation of underwater laser drilling for brittle substrates. Journal of materials processing technology, 2838_2846.
XII. Yoshiki.K. (2017). High-aspect ratio laser drilling of glass assisted by supercritical carbon dioxide. proceedings of spie, 10092. san francisco,california,united states.
XIII. Wanga, H., Xub, G., Zhua, S., Zhouc, W., Rena, N., & Xiaa, K. (2018, October 4). Comparison of percussion laser drilling quality with and without water based ultrasonic assistance. Journal of Manufacturing Processes, 36, 175-180.